WebSingle-switch IGBT module E = HiPak2 40 mm , Blocking voltage 1,7kV Ultra low-loss, rugged SPT+ chip-set Smooth switching SPT+ chip-set for good EMC AlSiC base-plate for high power cycling capability AlN substrate for low thermal resistance Improved high reliability package WEEE Category: Product Not in WEEE Scope WebMay 25, 2000 · Abstract: A new void free process for the solder joint between a chip mounted AlN substrate and a metal substrate in large-area, high power IGBT modules has been investigated. The following new process consists of two steps.

High Temperature, High Power Module Design for Wide …

WebLinPak phase leg IGBT module Vce = 1700V Ic = 2 x 1000A Ultra low inductance phase-leg module Compact design with very high current density Paralleling without derating AlSiC base-plate for high power cycling capability AlN substrate for low thermal resistance Low-loss, fast and rugged SPT++ chip-set WEEE Category: Product Not in WEEE Scope WebThis paper proposes a new hybrid power module architecture that allows wide bandgap semiconductor power devices to operate at a junction temperature of 300°C. The concept is based on the use of double metal or DCB leadframes, direct leadframe-to-chip bonding, and high temperature encapsulation materials. greenmong flyff universe

Highest Power density by 7th Gen IGBT StdType Module with New ...

WebIMB enables high power density implementation of IGBT module. Compared with ceramic substrates, thickness of the copper baseplate of IMB can be made thinner to reduce the weight. Besides, IMB does not require the solder layer below substrate. It results in better thermal cycling capability. WebHigh power IGBT module with new AlN substrate H. Nogawa, A. Hirao, Y. Nishimura, Y. Tamai, F. Momose, T. Saito, E. Mochizuki, Y. Takahashi Research output : Chapter in … WebThis design uses pressure-contact technology to establish a thermal connection between the module and heat sink. The life span of a power module with an AlN substrate is more than twice that of an Al 2 O 3 version. Features. Beneficial dielectric properties; High thermal conductivity; Low thermal expansion coefficient, close to that of Silicon green mongolian fur